Back Back

 


For full Warranty details please refer to the product profile!

 

 

Electronic Packaging Material - Potting and Encapsulating Materials


Details: EPM-2410 - Ideal for Static Mix and Dispense Applications Tack Free Within 8h at RTV

Product Profile: EPM-2410P.pdf
MSDS PDF A: EPM2410A.pdf
MSDS PDF B: EPM2410B.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Materials
NuSil ID: EPM-2410
Viscosity A:
Viscosity B:
Viscosity Mixed:
Flow/Viscosity: A:62,000 / B:40,000
Cure System: Platinum Addition
Solids Content:
Work Time: 30 M
Cure Time/Temp: 15 m / 150
Post Cure Time/Temp:
Specific Gravity:
Durometer Type A Certified:
Durometer Type A Typical: 30
Tensile psi Certified:
Tensile psi Typical: 750
Tensile MPa Certified:
Tensile MPa Typical: 5.2
Elongation Percent Certified:
Elongation Percent Typical: 350
Tear PPI Certified:
Tear PPI Typical:
Tear kN/m Certified:
Tear kN/m Typical:
Ionic Content* CI - K / Na ppm
Lap Shear psi/Mpa:
Volume Resistivity** ohm·cm 1 x 1015
Dielectric Strength V/mil:
Operating Temp: -115 to 265
Plasticity/Viscosity/Extrusion Typical:
Stress Strain:
Mix Ratio: 1:1
Colour: Trans
Comments: Ideal for Static Mix and Dispense Applications Tack Free Within 8h at RTV

 

Back
Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!
 
       
       


#Cookies set! #Google set! #Piwik set!