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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM-2421 - Low Viscosity, Self-leveling General Adhesive and Encapsulate, CTE 400 ppm/-¦C
| Product Profile: | EPM-2421P.pdf |
|---|---|
| MSDS PDF A: | EPM2421A.pdf |
| MSDS PDF B: | EPM2421B.pdf |
Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM-2421 |
| Viscosity A: | |
| Viscosity B: | |
| Viscosity Mixed: | |
| Flow/Viscosity: | A:3,700 / B:2,600 |
| Cure System: | Platinum Addition |
| Solids Content: | - - |
| Work Time: | 3 h |
| Cure Time/Temp: | 15 m / 150 |
| Post Cure Time/Temp: | - - |
| Specific Gravity: | 1.02 |
| Durometer Type A Certified: | - - |
| Durometer Type A Typical: | 50 |
| Tensile psi Certified: | - - |
| Tensile psi Typical: | 850 |
| Tensile MPa Certified: | - - |
| Tensile MPa Typical: | 5.9 |
| Elongation Percent Certified: | - - |
| Elongation Percent Typical: | 90 |
| Tear PPI Certified: | - - |
| Tear PPI Typical: | - - |
| Tear kN/m Certified: | - - |
| Tear kN/m Typical: | - - |
| Ionic Content* CI - K / Na ppm | |
| Lap Shear psi/Mpa: | - - |
| Volume Resistivity** ohm·cm | |
| Dielectric Strength V/mil: | 610 |
| Operating Temp: | -65 to 250 |
| Plasticity/Viscosity/Extrusion Typical: | - - |
| Stress Strain: | - - |
| Mix Ratio: | 1:1 |
| Colour: | Trans |
| Comments: | Low Viscosity, Self-leveling General Adhesive and Encapsulate, CTE 400 ppm/-¦C |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
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