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Electronic Packaging Material - Potting and Encapsulating Materials


Details: EPM-2463 - Green-gray paste Remains Conductive at High Temperature


Product Profile: EPM-2463P.pdf
MSDS PDF A: EPM2463A.pdf
MSDS PDF B: EPM2463B.pdf
Basic Product Overview:
Section: Electronic Packaging Material
Description: Potting and Encapsulating Materials
NuSil ID: EPM-2463
Flow/Viscosity: 4
Cure System: Tin Condensation
Work Time: 2 H
Cure Time/Temp: 7 D / R.T.
Specific Gravity: 3.4
Durometer Type A Typical: 80
Tensile psi Typical: 300
Tensile MPa Typical: 2.1
Elongation Percent Typical: 75
Tear PPI Typical: 55
Lap Shear psi/Mpa: 175/1.2
Mix Ratio: 100:0.5
Colour: Green
Comments: Green-gray paste Remains Conductive at High Temperature

 

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Back Please note:
Alternative sizes and packaging can and may be supplied, subject to availability of stock.
Products pictured may vary and illustrations are for guidance only!

 



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