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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM-2491 - Low outgas thermally conductive electrically insulating
| Product Profile: | EPM-2491P.pdf |
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Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM-2491 |
| Flow/Viscosity: | 900k |
| Work Time: | 2.5 H |
| Cure Time/Temp: | 4 H / 65 |
| Specific Gravity: | 1.45 |
| Tensile psi Typical: | -225 |
| Tensile MPa Typical: | 1.6 |
| Elongation Percent Typical: | 55 |
| Tear PPI Typical: | 55 |
| Tear kN/m Typical: | 9.7 |
| Mix Ratio: | 10:1 |
| Colour: | White |
| Comments: | Low outgas thermally conductive electrically insulating |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
