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For full Warranty details please refer to the product profile!
50ml cart 1-1 kit
400ml cart 1-1 kit
2 pint kit 1 - 1 plastic
2 gallon kit 1 - 1 plastic bucket
10 gallon kit 1 - 1 plastic
Engineering Materials - General Purpose - Potting and Encapsulating Materials for Electronics
Details: R-2188 - Pourable and self-leveling Cures at lower temperatures (≥70°C)
| Product Profile: | R-2188.pdf |
|---|---|
| MSDS PDF A: | SDS R-2188.pdf |
Basic Product Overview: |
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| Section: | Engineering Materials - General Purpose |
| Description: | Potting and Encapsulating Materials for Electronics |
| NuSil ID: | R-2188 |
| Flow/Viscosity: | A:13k / B:9k |
| Cure System: | Platinum |
| Work Time: | 8 HR + |
| Cure Time/Temp: | 30 M / 150°C |
| Specific Gravity: | 1.05 |
| Durometer Type A Typical: | 20 |
| Tensile psi Typical: | 475 |
| Tensile MPa Typical: | 3.3 |
| Elongation Percent Typical: | 350 |
| Mix Ratio: | 1:1 |
| Colour: | Trans |
| Comments: | Pourable and self-leveling Cures at lower temperatures (≥70°C) |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
