| |
| Electronic Packaging Material |
Glob Top |
EPM-2411-2 |
Platinum Addition |
Black |
Glop-top Shear Thining Index 2.5 |
|
| Electronic Packaging Material |
Thermal Interface Materials (TIMs) |
EPM-2401 |
Grease |
White |
Bulk Thermal Conductivity 0.49 W/m K Resistance to Moisture, Ozone and Oxidation |
|
| Electronic Packaging Material |
Thermal Interface Materials (TIMs) |
EPM-2462 |
Platinum Addition |
Tan |
Electrically Conductive - Excellent Adhesion to Aluminum |
|
| Electronic Packaging Material |
Thermal Interface Materials (TIMs) |
EPM-2490 |
Platinum Addition |
White |
Adheasive - Bulk Thermal Conductivity 1.25 W/m K |
|
| Electronic Packaging Material |
Thermal Interface Materials (TIMs) |
EPM-2890 |
|
White |
Thermally conductive, non-corrosive RTV Silicone Adhesive |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2463 |
Tin Condensation |
Green |
Green-gray paste Remains Conductive at High Temperature |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2491 |
|
White |
Low outgas thermally conductive electrically insulating |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2495 |
|
White |
Thermally conductive silicone Cures with the addition of heat |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM-2423 |
Platinum |
Clear |
Legacy material used for adhering solvent cells to composite substrates |
|
| Electronic Packaging Material |
Potting and Encapsulating Materials |
EPM1-2493 |
|
White |
Thermally conductive, low viscosity silicone elastomer cures with the addition of heat |
|
